Spring Pin Socket for BGA484

Oct. 20, 2023
Constructed with stamped spring pin technology with copper compression plate for heat dissipation along with thermocouple location for monitoring temperature. With swivel lid operation, it is easy to swap the device and characterize.

Constructed with stamped spring pin technology with copper compression plate for heat dissipation along with thermocouple location for monitoring temperature. With swivel lid operation, it is easy to swap the device and characterize.

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