EP4S-80

Jan. 4, 2022
One component, silver filled epoxy with a curing temperature of 80°C

Key Features

  • Low viscosity
  • Not premixed and frozen
  • Good electrical conductivity
  • NASA low outgassing

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. It is not premixed and frozen and has a working life of 8-12 hours, and requires heat for curing. The cure schedule is simple and straightforward, 60 to 90 minutes at 80°C. It has superb dimensional stability, very low shrinkage upon curing, and contains no solvents or diluents.

EP4S-80 bonds well to a wide variety of substrates such as metals, ceramics, composites, and many plastics. It is a high modulus, high compressive strength system. Its electrical conductivity is satisfactorily functional, with a volume resistivity between 0.02 to 0.06 ohm-cm. EP4S-80 fits very nicely in bonding, sealing and gap filling applications, particularly for static dissipation and EMI/RFI shielding. It can also be considered for specialty encapsulation type applications where electrical conductivity is desirable. This system resists water, oils and fuels. The service temperature range is -60°C to +150°C. EP4S-80 should be considered in a broad array of electronic applications including opto-electronics, acoustical, automotive systems, as well as PCB assembly.

Product Advantages

  • One component, no mixing needed
  • Will not cure until heated
  • Curing temperature 80°C
  • Low viscosity
  • Brushable

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