Bonding and adhesives

Case Study: EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies

Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature...

Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications

Master Bond

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to...

Bonding and adhesives

Flowable Silicone Offers Thermal Cycling and Shock Resistance

Master Bond

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can ...

Bonding and adhesives

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.

Bonding and adhesives

EP4S-80

Master Bond

One component, silver filled epoxy with a curing temperature of 80°C

Bonding and adhesives

Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy

Master Bond

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

Bonding and adhesives

EP40TC

Master Bond

Two component, thermally conductive, electrically insulative epoxy system for bonding and sealing

Adhesives, encapsulants and bondings

Product Spotlight: EP93FRHT

Master Bond

Specifically designed for avionic/aviation applications, Master Bond EP93FRHT readily passes the stringent Airbus specifications for vertical burn test, smoke emission and toxic...