Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...
Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low ...
Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature...
Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to...
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can ...
Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
Specifically designed for avionic/aviation applications, Master Bond EP93FRHT readily passes the stringent Airbus specifications for vertical burn test, smoke emission and toxic...
Master Bond UV26 is a new one part UV curable system featuring an exceptionally high glass transition temperature (Tg) ranging from 160 to 170°C. This NASA low outgassing ...
Master Bond EP41S-6 is a two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust...
Selecting an adhesive with a low coefficient of thermal expansion (CTE) is one of the approaches to improve the bond strength and stability between dissimilar substrates. Low ...
