Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

June 20, 2016

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with the addition of heat at 80°C for 40-60 minutes. This advantageous low temperature is useful when working with plastics or other heat sensitive substrates.

UV22DC80 is optically clear with a refractive index of 1.52 and passes NASA low outgassing testing per ASTM E595. It is a competent electrical insulator and features a volume resistivity exceeding 1014 ohm-cm. These properties make this compound well suited for high tech applications in aerospace, optical, optoelectronics and related industries.

As a nanosilica filled system, UV22DC80 delivers superior abrasion resistance, low shrinkage upon cure and dimensional stability. It bonds well to a wide variety of substrates, including metals, glass, ceramics and many plastics. UV22DC80 is a high strength product featuring a tensile strength of 6,000-8,000 psi. This system also resists chemicals such as acids, bases, fuels and solvents.

UV22DC80 has a service temperature range of -60°F to +350°F [-51°C to +177°C]. It can also withstand rigorous thermal cycling. This system has a glass transition temperature of 90°C, which can be increased to over 125°C if post cured at 125-150°C for 15-30 minutes. UV22DC80 is available for use in standard packaging in sizes ranging from ½ pints to 5 gallon containers and in convenient syringe dispensers.

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