XPand3200 Series | Sub-½ ATR, Conduction-Cooled Systems Supporting Conduction-Cooled Modules

Jan. 9, 2013
The XPand3200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. XPand3200 Series systems are based on a conduction-cooled, fully ruggedized chassis designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today’s avionics and ruggedized environments, size really does matter, and the XPand3200 Series sets a new standard for sub-½ ATR computing.Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.An optional SATA SSD memory module provides the convenience of removable storage and the ruggedness of solid-state memory at up to 64 GB. An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28 VDC or 115 VAC input. Internal EMI filtering and hold-up for up to 60 ms at 200 W are also provided.

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