Explore the future of ultra-compact computing with VNX+ (VITA 90) standards in Dec. 5th webinar

Nov. 30, 2023
Join us for this FREE event and learn more about VITA 90's features, including more tightly defined utility, communications, and a new overlay segment, provisions for blind-mate optical and coax connections, and much more!

NASHUA, N.H. - Military + Aerospace Electronics cordially invites you to our 5 December webinar where you can learn more about how the future of ultra-compact computing will be impacted by VNX+, also known as VITA 90. This event is sponsored by Elma Electronic in Fremont, California, and Samtec in New Albany, Indiana.  

Significant efforts are being made to bring open standards into next-gen designs to meet the Department of Defense's (DOD’s) Modular Open Standards Approach (MOSA) initiatives, most notably the development of new multi-mission defense platforms using the Sensor Open Standards Architecture (SOSA) Technical Standard.  

The most recent work within the standards working groups is addressing the need for a form factor "significantly smaller than 3U VPX" but still in alignment with SOSA principles of modularity, scalability, interoperability, and replaceability to address severe SWaP constraints and yet maintain scalability and interoperability that OpenVPX and SOSA provide.  While still a work in progress, VNX+ is maturing rapidly. This rugged, modular small form factor module hardware architecture is an attractive approach for severely size, weight, and power (SWaP)-constrained platforms regardless of their deployment environment.

VITA 90 offers features including more tightly defined utility, communications, and a new overlay segment, provisions for blind-mate optical and coax connections, power supply module definitions, well-defined slot profiles for payload modules, switches, PNT/Radial Clock modules, and even space payloads.

This webcast will delve into VNX+, review the current status of the various VITA 90 standards documents, as well as details of SOSA’s adoption. The speakers will discuss the ramifications of designing ever-smaller platforms while trying to meet increasingly greater power and cooling demands of high-performance processors. Considerations for signal integrity and aperture ramifications as well as examples of applications that can benefit will be addressed.

Presenters include Mark Littlefield, director of systems products at Elma Electronic and John Riley, senior technical marketing engineer at Samtec. Littlefield is an active contributor to multiple VITA and SOSA technical working groups including the SOSA small form factor (SFF) sub-committee and was co-chair of the VITA 65 OpenVPX working group. He has more than 25 years of experience in embedded computing

For more than 20 years, Riley has defined, designed, developed, and tested high-performance copper, RF, and optical interconnect for a number of embedded computing applications. Additionally, he and his wife champion STEM education, advanced manufacturing techniques, and community outreach via their non-profit maker space. 

Don't miss this free opportunity to enhance your understanding of VITA 90 and ultra-compact small form factor computing envelopes! Join us on 5 December 2023 at 2:00 p.m. Eastern. Please click here to learn more and to register! 

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