C-MAC MicroTechnology receives U.S. space electronics certification

C-MAC MicroTechnology, a high-reliability electronics provider in Wooburn Green, England, has earned the MIL-PRF-38534 Class K space accreditation from the U.S. Defense Supply Center Columbus (DSCC) in Columbus, Ohio.

May 1st, 2007

WOOBURN GREEN, England - C-MAC MicroTechnology, a high-reliability electronics provider in Wooburn Green, England, has earned the MIL-PRF-38534 Class K space accreditation from the U.S. Defense Supply Center Columbus (DSCC) in Columbus, Ohio.

C-MAC designs and builds high-reliability electronics for aerospace, defense, automotive, industrial, and medical applications. This accreditation recognizes C-MAC’s ability to design and manufacture hybrid microelectronics for space applications.

The worldwide space industry is currently worth $115 billion and is predicted to grow at more than 17 percent each year for the next 10 years.

“This is the start of an exciting new chapter for C-MAC, putting us in a unique position to progress within the space market, in addition to representing a significant step forward for the European electronics industry in general,” says Indro Mukerjee, chief executive officer of C-MAC MicroTechnology.

To fulfill the MIL Class K criteria, C-MAC’s manufacturing facility underwent a rigorous audit, conducted by DSCC, NASA, the Aerospace Corporation, and QinetiQ.

Following this, C-MAC is considered to be a certified manufacturer to MIL-PRF-38534 Class H and K effective from March 7th 2007. C-MAC had already set a precedent in fulfilling stringent U.S. electronics manufacturing requirements, becoming the first non-U.S. company to meet the U.S. defense performance specification, MIL-PRF-38534, MIL Class H, in 1992.

C-MAC MicroTechnology specializes in advanced high reliability hybrid microelectronics systems, advanced thermal management, high-power and high-frequency electronic solutions.

The company’s production sites operate are certified to ISO AS 16949 and MIL-PRF-38534. C-MAC process technologies include thick-film printing on ceramic and other substrates, surface-mount hybrid circuits, DC-DC power modules, direct-attach flipchip, low-temperature cofired ceramic (LTCC), chip-on-board (COB), multichip module (MCM) assemblies and PCB assembly.

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