High-rel thin-film chip attenuators available

Engineers at State of the Art Inc. of State College, Pa., are making their line of high-reliability thin-film chip attenuators available in the industry-standard case size of 0.75 by 0.6 by 0.1 inches. These components are for RF applications such as base stations and antennas, as well as for microwave applications in power dividers and power amps where reduction of an electrical signal is necessary. The device comes in four termination styles. Metallization options include solderable, epoxy-bon

Jun 1st, 1998

Engineers at State of the Art Inc. of State College, Pa., are making their line of high-reliability thin-film chip attenuators available in the industry-standard case size of 0.75 by 0.6 by 0.1 inches. These components are for RF applications such as base stations and antennas, as well as for microwave applications in power dividers and power amps where reduction of an electrical signal is necessary. The device comes in four termination styles. Metallization options include solderable, epoxy-bondable, and wire-bondable types. The chip attenuators come with an alumina body, and a proprietary thin-film resistor element. For more information, contact Bernie Hoy of State of the Art at 800-458-3401, by fax at 814-355-2714, or on the World Wide Web at http://www.resistor.com/. - J.K.

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