Rugged solid-state memory packaged in plastic BGA for avionics, UAVs, and missiles introduced by Microsemi

PHOENIX, 4 Nov. 2011. The Microsemi Corp. Power and Microelectronics Group in Phoenix is introducing a rugged solid-state memory packaged as a DDR3 SDRAM memory device in one plastic ball grid array (PBGA) for avionics, unmanned aerial vehicles (UAVs), missile systems, and other aerospace and defense applications that require high reliability in harsh environments.

The solid-state memory device comes in a x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM), and provides as much as four gigabytes of compact memory that support high-performance processors and chipsets in mission-critical applications.

Microsemi's commercial off-the-shelf (COTS) DDR3 SDRAM devices offer a standalone, high-density memory solution that also meets the data widths necessary for many applications. The DDR3 devices can reduce space requirements as compared to systems built from discrete memory components, and also use less board space than memory solutions using chip scale packages (CSPs) and other single-die solutions, company officials say.

Microsemi's memory devices also streamline I/O routing and reduce component count and placements while delivering superior signal integrity. the device measures 23 by 32 millimeters on a one-millimeter pitch; comes in a 543 PBGA package with tin-lead balls; supports data rates of 800, 1,066 ,and 1,333 megabits per second; operates on a 1.5 volt power supply; and is available in commercial- and industrial-temperature ranges.

Microsemi uses a four-nanosecond prefetch architecture with an interface that transmits two data words per clock cycle. The devices can be ruggedized and processed for tamper resistance.

For more information contact Microsemi Power and Microelectronics online at www.whiteedc.com