Learn about rugged enclosure design for mission critical environments at 28 Oct. webinar discussion

Electronics don’t live in labs anymore—they endure shock, heat, vibration, and the harshest field conditions. This event is sponsored by Elma Electronic/Optima Stantron.
Oct. 21, 2025
2 min read

NASHUA, N.H. - Military + Aerospace Electronics cordially invites you to a round table discussion with industry experts who will unpack what it takes to design rugged, reliable enclosures for real-world applications. This free event, which  takes place at 2 p.m. on 28 October 2025, is sponored by Optima Stantron, an Elma Electronic company. 

Gone are the days when electronics stayed in clean, temperature-controlled rooms. Today’s systems face shock, heat, vibration, and isolation - and the cabinets that protect them must rise to the challenge. In this panel discussion, Elma Electronic engineers will cover topics like environmental and EMI standards (MIL-DTL-901E, MIL-STD-810, MIL-STD-461), modular aluminum construction, EMI shielding, and advanced thermal management.

Attendees will learn how to select and specify cabinets that deliver structural integrity, future-ready modularity, and mission reliability across defense, aerospace, and industrial applications. The discussion includes case examples from radar systems, ground shelters, and unmanned platforms.

Your questions answered

A live Q&A session will follow the presentation, with engineering support from Elma/Optima Stantron experts available to address detailed questions. Expert insights will come from Cameron Thomas, mechanical design engineer, and Michael Robitaille, regional sales and enclosure subject matter expert.

Thomas is a Mechanical Design Engineer at Elma Electronic, focused on complex cabinet and enclosure design. After completing his BS ME at Vanderbilt University, he joined Elma in his first engineering role—continuing a family connection to the company. 

Robitaille has been working in the enclosure industry for over 30 years, serving as a design specialist to help customers solve complex packaging and thermal challenges. As a result of his longevity in the industry, he has become a subject matter expert in collaborating with and delivering consultative solutions that meet and exceed program requirements.

For more information or to register for this free event, please click here

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