TM Soldering Solutions introduces PHOENIX selective soldering platform for PCB assembly

The platform is designed to support through-hole soldering processes in modern electronics manufacturing environments, where repeatability and integration with automated production lines are critical.
May 6, 2026
2 min read

SPOKANE VALLEY, Wash. - TM Soldering Solutions in Spokane Valley, Wash., has introduced its PHOENIX platform for selective soldering, targeting printed circuit board (PCB) assembly applications with an emphasis on process control, reliability, and automation.

The PHOENIX system is available in both batch and in-line configurations. The platform is designed to support through-hole soldering processes in modern electronics manufacturing environments, where repeatability and integration with automated production lines are critical.

The PHOENIX-IL in-line configuration provides automated flux application, precision solder delivery, and process control through the company’s EmberX software environment. These capabilities are intended to improve solder joint consistency, reduce operator variability, and enable tighter control over thermal and material parameters during assembly.

The system builds on selective soldering technologies previously developed by ACE Production Technologies, incorporating refinements in motion control, fluid handling, and software-driven process management. The platform is designed for integration into high-mix, high-reliability PCB manufacturing lines, including applications where through-hole components must be soldered alongside surface-mount devices.

TM Soldering Solutions manufactures its systems in Spokane Valley, Wash., and says that its engineering team has experience delivering more than 1,200 selective soldering systems. The company also maintains spare parts inventory and provides technical support for deployed systems.

For more information, please visit https://www.tmssolutions.us.