MANASSAS, Va. - BAE Systems has demonstrated the resilience of its Endura system-on-chip (SoC) space processor in testing designed to evaluate performance in natural space radiation and strategic radiation environments.

The Endura SoC is manufactured using the company's radiation-hardened 45-nanometer (RH45) technology, which is based on GlobalFoundries' commercial 45-nanometer silicon-on-insulator manufacturing platform. According to BAE Systems, the technology combines commercially licensed intellectual property with radiation-hardened application-specific integrated circuit (ASIC) design and manufacturing techniques to support space applications requiring high radiation tolerance.

The company says the testing also demonstrated that the RH45 technology can improve the survivability of other space electronics, including single-board computers.

The processor is being integrated into BAE Systems' next-generation Endura product family, which is expected to provide general-purpose processing, networking, secure boot capability, and other onboard computing functions. The devices include integrated Level 1 and Level 2 cache memory along with field-programmable gate array (FPGA) resources intended to support mission-specific acceleration and hardware-accelerated input/output.

BAE Systems says the Endura product line is intended for a range of space missions, including high-reliability Class A missions as well as lower-assurance Class C and Class D missions. The company is accepting orders for software development units based on the Endura SoC.

The processors are developed by BAE Systems' Space Systems organization in Manassas, Virginia. The facility is designated as a U.S. Department of Defense Category 1A Trusted Supplier for microelectronics design, packaging, assembly, testing, and related services.

For more information, please visit https://www.baesystems.com.