Hermetic miniature RF and microwave connector for high-density packaging introduced by AMETEK

April 12, 2016
NEW BEDFORD, Mass., 12 April 2016. AMETEK Electronic Components & Packaging in New Bedford, Mass., is introducing the has introduced the Sub-Miniature Press-On-Sub-Micro (SMPS) hermetic miniature RF and microwave connector for high-density packaging and multiport applications.

NEW BEDFORD, Mass., 12 April 2016. AMETEK Electronic Components & Packaging in New Bedford, Mass., is introducing the Sub-Miniature Press-On-Sub-Micro (SMPS) hermetic miniature RF and microwaveconnector for high-density packaging and multiport applications.

The SMPS hermetic, push-on and blind-mate RF connector is capable of frequencies to 65 GHz, exceeding the 40 GHz maximum frequency of the SMPM connector.

“The new SMPS hermetic connector highlights AMETEK ECP’s efforts in design innovation” says Ceasar Morte, head of engineering at AMETEK. “Our manufacturing team can customize body length, pin extensions and terminations, as well as offer solder and weld options for the connector body."

AMETEK Electronic Components & Packaging provides electronic and electromechanical packages for harsh-environment and reliability-sensitive applications in the aerospace, defense, automotive, industrial, medical, optical communications, and oil and gas industries.

Related: Electronics cooling fan for harsh military and aerospace environments introduced by AMETEK Rotron

For more information contact AMETEK online at www.ametek-ecp.com.

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