GRENOBLE, France – Teledyne e2v, a Teledyne Technologies company in Grenoble, France, is introducing the Hydra3D+ time-of-flight CMOS image sensor for pick and place, logistics, factory automation, and factory safety.
The sensor incorporates 832-by-600-pixel resolution, is tailored for 3D detection and measurement, and works in all light conditions.
Designed with Teledyne e2v's proprietary CMOS technology, Hydra3D+ features a 10-micron three-tap pixel that provides fast transfer times starting from 10 nanoseconds, and displays high sensitivity in the near-infrared wavelength, and demodulation contrast.
This combination enables the sensor to operate in real time without motion artifacts, even if there are fast moving objects in the scene. It offers an on-chip multi-system management feature that enables the sensor to work alongside several active systems without interference that can lead to false measurements.
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The sensitivity of Hydra3D+ enables it to manage lighting power and handle a wide range of reflectivity. Its high resolution, with powerful on-chip HDR enables a tradeoff between distance range, object reflectivity, and frame rate.
This makes it suitable for mid, long-range distances and/or outdoor applications such as automated guided vehicles, surveillance, ITS and building construction. The sensor offers large field-of-view scenes captured in 2D and 3D by a compact sensor that makes the system cost effective.
For more information contact Teledyne e2v online at www.teledyne-e2v.com.
