WATERLOO, Ontario – Teledyne DALSA in Waterloo, Ontario, is introducing the Linea HS 16k backside illuminated (BSI) TDI camera for near-ultraviolet and visible-light imaging applications such as wafer, flat panel display and electronic packaging inspection as well as photoluminescence and life science imaging.
With its CLHS interface, this camera offers enhanced sensitivity, and uses Teledyne DALSA's charge-domain CMOS TDI 16k sensor with a 5x5-micron pixel size and delivers a maximum line rate of 400 kHz aggregate.
Compared with front side illumination, the BSI model significantly improves quantum efficiency in the near-ultraviolet and visible wavelengths and boosts signal-to-noise ratio for imaging applications in light-starved conditions.
Linea HS is for high-speed and high-sensitivity imaging, and provides performance based on multi-array charge-domain CMOS TDI technology, offering advanced capabilities including mono/HDR, color, multifield, and super resolution imaging for demanding machine vision.
Linea HS 16k BSI has the same form factor as the Linea HS FSI, and uses a CLHS data interface that delivers 6.5 gigapixels per second data throughput in one cable.
An active optical cable enables a long cable length to eliminate the need for a repeater to improve data reliability and reducing system costs. For more information contact Teledyne DALSA online at www.teledynedalsa.com/en/home.