FOUNTAIN INN, S.C. – AVX Corp. in Fountain Inn, S.C., is introducing a line of ultraminiature, thin-film transmission line capacitors for high-frequency links, DC blocking in the UHF range (300 MHz to 3 GHz), and other high-performance RF and microwave applications.
The capacitors have a metal-insulator-metal (MIM) structure, copper traces for optimal circuit conductivity, a transmission line wire-bond pad, and a gold-metallized backside ground, and come with low-loss substrates like quartz, alumina, glass, and silicon.
The transmission line capacitors also are available in capacitance values from 0.3 to 50 picofarads with a plus-or-minus 20 percent tolerance. Each is made using a high-frequency structure simulator (HFSS) to address electromagnetic challenges and provide the high RF performance and reliability.
The transmission line capacitors are available in three standard substrate thicknesses: 5, 10, and 15 mils and two standard substrate widths: 20 and 40 mils, and have design-dependent lengths determined by transmission line dimensions. Average lengths are 20 to 80 mils.
The devices are rated to 100 volts, have capacitance values from 50 to 100 picofarads per square millimeter, and a dissipation factor of less than 0.1 percent. They exhibits 50 Ohms standard impedance. Custom impedance values, substrate materials, and substrate thicknesses are available.
The transmission line power capacitors also are RoHS compliant and are tested to MIL-STD-883-2011.8 for bond strength, MIL-STD-883-2018 for shear strength, and MIL-STD-202-108 for lifetime. Packaging options include antistatic waffle pack, tested but undiced, and tested, and diced on tape.
For more information contact AVX online at www.avx.com.
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