Beyond OpenVPX: Get a sneak preview of the next generation modular form factor – VITA 100
Duration: 1 hour
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Summary
VITA 100 is a next-generation plug-in module form factor currently being standardized by the VITA Standards Organization as a follow-on to OpenVPX. It represents the natural progression of performance and technological advancement that the market previously experienced growing from VME and VME64 on to OpenVPX. In this webcast we will give a sneak preview of the next generation MULTIGIG RT connector selected by the VSO as the new standard, examine what enables the enormous boost in performance we can expect from VITA 100 and some of the interesting technical features that are currently in discussion in the working groups, and wrap up with the overall schedule that has been proposed for VITA 100’s roll-out.
Speakers
Mark Littlefield
Director, System Products
Elma Electronic
Mark Littlefield is director of systems products for Elma Electronic. He is an active contributor to multiple VITA and SOSA technical working groups, including the SOSA small form factor (SFF) sub-committee, and was co-chair of the VITA 65 OpenVPX working group. He has more than 25 years of experience in embedded computing, where he has held a range of technical and professional roles supporting defense, medical, and commercial applications.
Mark holds bachelor's and master’s degrees in control systems engineering from the University of West Florida.
Mike Walmsley
Product Management, Emerging Connectors
TE Connectivity
Michael Walmsley is the Product Manager for Emerging Connectors at TE Connectivity. With a bachelor's degree in Mechanical Engineering for the University of Rochester, and an MBA from Penn State University, he has over 35 years’ experience with interconnects primarily in engineering and product management roles. His areas of expertise include interconnect solutions for embedding computing, rugged high speed board level and RF Connectors.
Michael is actively involved with the VITA organization, which drives technology and specifications for the modular open standards.
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