Pixus upgrades 1U MicroTCA enclosure to PCI Express Gen 3 for embedded computing applications

July 5, 2016
WATERLOO, Ontario, 5 July 2016. Pixus Technologies in Waterloo, Ontario, is upgrading the company's 1U MicroTCA enclosure system to PCI Express Gen 3 for aerospace and defense embedded computing applications.

WATERLOO, Ontario, 5 July 2016. Pixus Technologies in Waterloo, Ontario, is upgrading the company's 1U MicroTCA enclosure system to PCI Express Gen 3 for aerospace and defense embedded computing applications.

The company will continue to upgrade its various configurations of MicroTCA solutions to the higher-speed standard. The Pixus PXS0108 MicroTCA chassis platform has six Advanced Mezzanine Card (AMC) slots and 1 MicroTCA Carrier Hub (MCH) slot.

Various power options are available, including a dual-redundant configuration. The PXS0108 has an active backplane that alleviates the need for expensive power modules (PMs). The backplane provides a power manager for each slot that controls and limits the management and payload power to the maximum allowed.

PCI Express Gen 3 brings the backplane speed to 8 gigabytes per second in single x8 or dual x4 options. Other backplanes are available including 10 Gigabit Ethernet. The chassis can accept as many as three full-size AMC modules in lieu of the 6 midsize modules.

Related: 40-Gigabit Ethernet upgrades to AdvancedTCA embedded computing chassis introduced by Pixus

Pixus offers MicroTCA system platforms and AMCs in various sizes and configurations. The company also provides OpenVPX and AdvancedTCA backplane/chassis systems, boards, and components.

For more information contact Pixus Technologies online at www.pixustechnologies.com.

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