HACKENSACK, N.J. – Master Bond Inc. in Hackensack, N.J., is introducing the EP70CN two-part thermally stable epoxy adhesive for electronics and electro-optics bonding in aerospace and OEM applications.
Formulated using a natural, renewable, and sustainable ingredient, this epoxy system forms high physical strength bonds and is for bonding, sealing, coating and potting.
The tensile strength is 11,000 to 12,000 pounds per square inch and the tensile modulus, 300,000 to 350,000 pounds per square inch. It has a glass switch temperature of 130 to 135 degrees Celsius. It has a good chemical resistance profile when cured at the optimal cure schedule.
EP70CN is a low-viscosity formulation with a mixed viscosity of 2,500 to 5,000 Centipoise (cps). With a working life of 60 to 90 minutes and a variety of curing options, the optimal cure schedule is overnight at room temperature followed by three to four hours at 140 to 170 degrees Fahrenheit.
EP70CN bonds well to a wide variety of substrates including metals, ceramics, many rubbers, plastic materials, and especially composites with low shrinkage on cure. Its wetting properties make it suitable for applications involving bonding and sealing fibers.
EP70CN has a high volume resistivity (greater than 1014 ohm-cm) and a relatively low exotherm. This combination of properties enables it to be used in many encapsulating applications.
The EP70CN adhesive comes in standard packaging of half-pint, pint, quart, and gallon kits, as well as in specialty packaging of premixed and frozen syringes and FlexiPaks.
For more information contact Master Bond online at www.masterbond.com.
Ready to make a purchase? Search the Military & Aerospace Electronics Buyer's Guide for companies, new products, press releases, and videos