Industry briefings set for 3D heterogeneous integration (3DHI) military microelectronics manufacturing

Summary points:

• DARPA will brief industry on plans to create the nation’s first center for U.S.-based 3D heterogeneous integration (3DHI) microelectronics research and pilot production.
• The Next-Generation Microelectronics Manufacturing Summit will be 28 and 29 Oct. 2025 at the University of Texas AT&T Hotel and Conference Center in Austin, Texas.
• Program will include a technology development roadmap, how to engage in 3DHI efforts, and updates on infrastructure, equipment, and key project milestones.

AUSTIN, Texas – U.S. military researchers will brief industry in October on their latest plan to boost future military microelectronics manufacturing technologies by establishing a national center for advancing U.S.-based 3D heterogeneous integration (3DHI).

Officials of the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., conduct industry briefings at the Next-Generation Microelectronics Manufacturing (NGMM) Summit from 8:30 a.m. to 5 p.m. on 27 2025, and from 7:30 a.m. to 1:30 p.m. on 28 Oct. 2025 at the University of Texas AT&T Hotel and Conference Center in Austin, Texas.

NGMM, aims to unlock accessible prototyping for the microelectronics of tomorrow by establishing the first-ever national center for advancing U.S.-based 3DHI. The goal is to develop a self-sustaining manufacturing center for research and pilot production of high-performance 3DHI microelectronics.

Highlights of the conference will include participation; program timeline; how to get involved in 3DHI research and prototyping; a technology roadmap overview of 3DHI technology development; and the latest on facility, infrastructure, equipment, and key milestones.

Tell me more about 3D heterogeneous integration (3DHI)

• 3D Heterogeneous Integration (3DHI) stacks and interconnects several types of microelectronics components like logic, memory, sensors, and RF devices. It can combine different materials, node sizes, and functions to improve performance, power efficiency, and size. 3DHI also offers fast data transfer, and reduced latency in high-performance computing, artificial intelligence (AI), military, and mobile electronics..

The NGMM Summit will include presentations by government, industry, and academic personnel, with time for discussions and networking. All presentations and discussions will be unclassified.

3DHI enables the integrated stacking of several different semiconductor types, like processors, memory, MEMS, RF, and photonic chips. 3DHI fundamentally different from traditional monolithic or 2D semiconductor manufacturing because integration because each die may employ different manufacturing processes and materials.

Those interested in attending the NGMM Summit should register online no later than 6 Oct. 2025 at https://web.cvent.com/event/a2008e16-1158-40e0-a82b-f40f25180ede/websitePage:2fc2ad49-a6c5-49fd-ad2e-c256ec101e52.

Email administrative and technical questions to [email protected]. More information is online at https://sam.gov/opp/f70211813b674e99a314d44f2d66ff44/view.