Manufacturer of innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges. The company's modular systems are designed for maximum process flexibility and come in manual, semi-automatic or automatic configurations.
Multi-purpose Die Bonder for prototyping, low-volume production, R&D labs and universities. Versatile platform used in a wide range of micro assembly applications – flip chip ...
The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for ...