NASHUA, N.H. - Military + Aerospace Electronics cordially invites you to a free webinar on Thursday, 30 November 2023 to learn how to navigate the complex landscape of new ASIC designs, device packaging, and upscreening existing components for high-reliability microelectronics. This event is sponsored by Micross in Melville, New York.
During this seminar we will discuss the specific development requirements of 100% electrical testing compliance over all corners of voltage and temperature, and requirements that vary from commercial products in complexity, coverage, test time, small lot statistical analysis, and mission reliability. We will highlight key process and methodologies including Wafer Probe, Burn-in, Electrical Test, Electrical Device Validation, Package Assembly and Environmental Testing needed for Hi-Rel microelectronics. At the end, this webinar will provide you with a better understanding and appreciation of all the design and testing requirements for hi-rel microelectronics, enabling you with a greater advantage for program achievement and development success.
With the expansion of products and technology nodes available, and an increasingly competitive landscape. For successful program achievement to be realized it has become more critical than ever for engineers to understand all of their available Hi-Rel options, so that they may best navigate and determine the most appropriate microelectronics solution for the specific needs of their high reliability program. These solutions range from new ASIC development and characterization, to upscreening and PEM qualification of existing devices. This seminar will help engineers, program managers, and subcontractors better understand Hi-Rel device requirements to successfully complete MIL-PRF-38535, 38534, and varying SCD or AID specific qualifications and requirements.
Presenters include Mario Saucedo, general manager; and Ron Erikson, chief engineer, both of Micross STS. Saucedo has extensive experience in the telecommunications, industrial, defense, and space markets, with delivering engineering solutions for high-reliability applications. Erickson is an expert in Hi-Rel microelectronics electrical test, with a career spanning 22 years where he was directly responsible for new product development in test, product, and managing test, product, integrated circuit packaging, and design lab product validation engineering teams.
To learn more, or register for this FREE event, please click here!
