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Best Practices in BGA Assembly Inspection
June 21, 2024
Ball grid array (BGA) inspection can be challenging because solder joints are under the component. This whitepaper looks at issues that can create defects and best practices in...
Computers
Researchers to brief industry this month on three-dimensional heterogeneously integrated microelectronics
Nov. 7, 2023
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Interconnect Technology
QuickChat: COTS products with SWaP in mind for Defense and Space applications
July 13, 2023
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NASA names businesses and research teams selected for tech development program
June 12, 2023
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Maintaining Critical Safety Standards in a Virtualized Environment
May 8, 2023
Embedded computers
SEMIL-1300 Series- Half-Rack Rugged Fanless Computer
Neousys Technology Inc
Dec. 22, 2022
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Embedded computers
SEMIL-1300GC Series- Wide-temp Fanless GPU Computer
Neousys Technology Inc
Dec. 22, 2022
Embedded computers
SEMIL-1700 Series- Half-rack IP67 Waterproof Computer
Neousys Technology Inc
Dec. 22, 2022
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