Master Bond

Hackensack, NJ 07601

COMPANY OVERVIEW

About Master Bond

Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.

Product Summary

Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable adhesives are reliable, come in convenient packaging and feature outstanding performance properties.

Contact

154 Hobart St
Hackensack, NJ 07601
United States
https://www.masterbond.com
201-343-8983
201-343-2132

More Info on Master Bond

Master Bond Logo 400x300b 605102ffc60b6

With a product line of over 3,000 formulations, Master Bond has been supplying aerospace and defense manufacturers with custom formulated compounds for structural bonding and a variety of electronic applications. Master Bond's mission is to develop cutting edge adhesives, sealants, coatings and potting/encapsulation systems utilizing advanced technology for challenging applications.

 High Performance Adhesives, Sealants & Coatings

Our expansive line of epoxies, silicones, UV curable and LED curable systems feature superior performance properties even in extreme conditions including:

  • High/low temperature resistance
  • Electrical conductivity/insulation
  • Thermal conductivity
  • High/low viscosity
  • Flexibility and toughness
  • Chemical resistance
  • Optical clarity

Our products feature superior long-term durability. They are used in a variety of industries and are designed to meet stringent industry standards and are certified for:

  • NASA low outgassing
  • Federal Aviation Regulations 25.853(a) for flame retardancy
  • UL 94V-0 and UL94V-1
  • UL 1203 for Explosion-Proof and Dust- Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations
  • U.S. MIL-STD 883J (Section 3.5.3) for thermal stability
  • U.S. MIL-STD 810G (Method 508.7) for fungus resistance.
  • Airbus testing for flame retardancy, smoke emission and toxicity
  • Boeing standards for low smoke and toxicity

Outstanding Customer Support

Master Bond makes customer support a fundamental priority in the adhesive selection process. Our technical specialists have decades of experience and will work with you, one-on-one, from the design, prototyping and manufacturing stages of your application.

Products

Ep21 Lvfl
Bonding and adhesives

EP21LVFL

Two component, low viscosity epoxy for bonding, sealing, coating, and potting featuring good flexibility
Ep40 Tc Med
Adhesives, encapsulants and bondings

EP40TCMed

Two component, thermally conductive, electrically insulative epoxy system for medical device applications
Supreme3 Dm 85
Adhesives, encapsulants and bondings

Supreme 3DM-85

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation
Ep5 Lte 100
Adhesives, encapsulants and bondings

EP5LTE-100

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C
Ep17 Htda 2
Adhesives, encapsulants and bondings

EP17HTDA-2

One component die attach epoxy system with exceptionally high glass transition temperature
Ep41 S 5 Med
Adhesives, encapsulants and bondings

EP41S-5Med

Two component epoxy system featuring excellent resistance to sterilants, solvents and autoclaving
Supreme42 Ht 2 Nd Black
Bonding and adhesives

Supreme 42HT-2ND Black

Two component, non-flow epoxy system for bonding, sealing and coating
Ep5 Tc 80
Adhesives, encapsulants and bondings

Master Bond EP5TC-80 is a one component, flowable paste epoxy for bonding, sealing and small encapsulation applications

One component thermally conductive, electrically insulating epoxy with a curing temperature of 80 degrees Celsius
Master Sil323 Ao Lo
Adhesives, encapsulants and bondings

MasterSil 323AO-LO

Two part thermally conductive, electrically insulating silicone for bonding and sealing

Press Releases

Courtesy of Master Bond
Adhesives, encapsulants and bondings

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Adhesives, encapsulants and bondings

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Adhesives, encapsulants and bondings

One Part Epoxy Changes from Red to Clear Under UV Light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...

Videos

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Adhesives, encapsulants and bondings

How Do You Use EP4EN-80 for Potting & Encapsulation Applications?

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
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Adhesives, encapsulants and bondings

About Master Bond

For over 40 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries.
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Adhesives, encapsulants and bondings

Product Spotlight: EP93FRHT

Specifically designed for avionic/aviation applications, Master Bond EP93FRHT readily passes the stringent Airbus specifications for vertical burn test, smoke emission and toxic...
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Adhesives, encapsulants and bondings

Webinar: How to Select the Right Adhesive for Aerospace Applications

Although there are many factors which can influence the selection process, the main focus of the discussion will be on the different cure mechanisms and the choice of fillers....

Resources

Ep21tdcs Lo 246
Bonding and adhesives

Case Study: EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies

Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature...
Mb Wp Thumbnail Optically Clear Adhesives 200x260
Adhesives, encapsulants and bondings

Clearly Superior: Epoxies for Optical Applications

When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be...
Mb Wp Thumbnail Polymeric Systems Bring Clarity Optical Apps 200x262
Adhesives, encapsulants and bondings

Polymeric Systems Bring Clarity to Optical Applications

Whereas some optical assembly applications require optical clarity across a certain wavelength, others require an opaque coating. Optical grade epoxies, silicones and UV curable...

Buyer’s Guide Listing Information

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Additional content from Master Bond

Adhesives, encapsulants and bondings

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
Adhesives, encapsulants and bondings

Food Grade Epoxy Features Enhanced Chemical Resistance

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
Adhesives, encapsulants and bondings

Flexible, Thixotropic, One Component Dual Cure Epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
Master Sil711 Med
Adhesives, encapsulants and bondings

One Part RTV Silicone Passes Non-Cytotoxicity Standards

Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.
Supreme17 Htnd 2
Adhesives, encapsulants and bondings

Toughened one-component epoxy features high-glass-transition temperature

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...
Ep21 Lvfl
Bonding and adhesives

Electrically insulative two-component epoxy features high elongation

Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram...
Ep40 Tc Med
Adhesives, encapsulants and bondings

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...
Supreme3 Dm 85
Adhesives, encapsulants and bondings

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...
Ep5 Lte 100
Adhesives, encapsulants and bondings

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...
Ep17 Htda 2
Adhesives, encapsulants and bondings

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment.
Led415 Dc90
Adhesives, encapsulants and bondings

Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure...
Ep41 S 5 Med
Adhesives, encapsulants and bondings

Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical ...
Supreme42 Ht 2 Nd Black
Bonding and adhesives

Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to...
Ep5 Tc 80
Adhesives, encapsulants and bondings

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability

Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity...
Master Sil323 Ao Lo
Adhesives, encapsulants and bondings

Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep4 Cl 80 Med
Adhesives, encapsulants and bondings

EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications
Ep4 Cl 80 Med
Adhesives, encapsulants and bondings

Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep40 Nd
Adhesives, encapsulants and bondings

Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio...
Ep17 Tf
Adhesives, encapsulants and bondings

EP17TF

One component, toughened epoxy system for bonding, sealing and coating
Ep17 Tf
Adhesives, encapsulants and bondings

Toughened One Part Epoxy Withstands Thermal Cycling

Master Bond EP17TF is a one part epoxy with a paste consistency, that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (Tg)...
Uv17 Med
Adhesives, encapsulants and bondings

UV17Med

UV system for high performance bonding, sealing and coating featuring superb adhesion to thermoplastic urethanes (TPUs)
Uv17 Med
Adhesives, encapsulants and bondings

Biocompatible UV Curable Adhesive Formulated for TPU Bonding

Master Bond UV17Med is a one part, no mix, UV curable system. It was specially formulated to provide excellent adhesion to many TPUs (thermoplastic polyurethanes), which are widely...
Master Sil 323
Bonding and adhesives

Flowable Silicone Offers Thermal Cycling and Shock Resistance

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can ...
Ep4 G 80 Med
Adhesives, encapsulants and bondings

Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to ...
Ep35 Aolv 0
Adhesives, encapsulants and bondings

Thermally Conductive Epoxy Features Chemical and High Temperature Resistance

Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications.
Ep35 Aolv 0
Adhesives, encapsulants and bondings

EP35AOLV

Two component, thermally conductive, electrically isolating epoxy system for bonding, sealing and potting
Ep21 Ac Dsc5959
Adhesives, encapsulants and bondings

EP21AC

Two component epoxy system for encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickness with a PLC of 0
Ep21 Ac Dsc5959
Adhesives, encapsulants and bondings

UL Certified Epoxy Encapsulant Resists Arcing Without Igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Ep4 S 80
Bonding and adhesives

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.