LONDON – Smiths Interconnect in London is introducing the HR TSX series of high-frequency surface-mount RF and microwave chip attenuators for high-reliability space and defense applications.
The HR TSX series is qualified to MIL-PRF-55342 and offers broadband performance to 50-GHz, while delivering increased power handling in a small 0604 surface-mount package.
These chip attenuators offer wider coverage than traditional components while providing optimized return loss for several frequency ranges. This enables systems designers to use one chip in several applications and reduces bill of materials (BOM) item count and cost.
The HR TSX series comes in group A, B or C testing based on MIL-PRF-55342. Qualification data is included with product delivery for program assurance.
The chip attenuator is available for surface mounting, offers 1 to 3 Watts of power handling, and several attenuation values. The all-thin-film process technology is built on an alumina substrate suitable for harsh environments.
For more information contact Smiths Interconnect online at www.smithsinterconnect.com.
