LONDON – Smiths Interconnect in London is introducing the TSX series of fixed-chip attenuators for harsh-environment space and defense applications. The TSX series is optimized to combine high frequency and power in a small package.
The TSX series is designed to offer broadband performance to 50 GHz, while delivering increased power handling in a small 0604 surface-mount package. It offers wider coverage than traditional components while providing optimized return loss for several frequency ranges.
This enables RF and microwave systems designers to use one chip in several applications, reducing the bill of material (BOM) item count and cost of ownership.
The rugged chip attenuator design, available for surface mounting, offers 1 to 3 Watts of power handling performance and several attenuation values. The use of an all thin film process on an alumina substrate provides a product suitable for harsh environments, such as those of space and defense applications.
Each product is engineered using 3D electromagnetic simulation (EM) software to provide performance in a total thin film process. Features include small form factor; surface mountability; broad frequency range; low voltage standing wave ratio (VSWR); wide range of attenuation values; and tight attenuation tolerance.
For more information contact Smiths Interconnect online at www.smithsinterconnect.com.
