CMOS X-Ray camera for non-destructive test and circuit board inspection offered by Teledyne

WATERLOO, Ontario, 22 May 2014. Teledyne DALSA in Waterloo, Ontario, is introducing the Rad-icon 1520 CMOS X-Ray camera for industrial X-ray inspection, scientific imaging, and non-destructive testing, including weld inspection, wire bond and printed circuit board (PCB) inspection, microfocus, computed tomography (CT) and other demanding industrial imaging applications.

May 22nd, 2014
CMOS X-Ray camera for non-destructive test and circuit board inspection offered by Teledyne
CMOS X-Ray camera for non-destructive test and circuit board inspection offered by Teledyne
WATERLOO, Ontario, 22 May 2014. Teledyne DALSA in Waterloo, Ontario, is introducing the Rad-icon 1520 CMOS X-Ray camera for industrial X-ray inspection, scientific imaging, and non-destructive testing, including weld inspection, wire bond and printed circuit board (PCB) inspection, microfocus, computed tomography (CT) and other demanding industrial imaging applications.

The Rad-icon 1520 electro-optical detector features 1548-by-2064-pixel resolution, an active area of 15.3 by 20.4 centimeters, and 99 micron pixel size. Rad-icon detectors deliver real-time frame rates to 30 frames per second, sensitivity, and resolution in a large area device that is integrated and available with a Gigabit Ethernet or Camera Link interface.

Rad-icon digital X-ray cameras leverage Teledyne DALSA's advanced CMOS image sensing technology that enables the delivery of higher image quality than a-Si flat panels and image intensifier devices.

Other features include 5 lp/mm resolution; energy range from 10 to 225 kilovolts; 14-bit digitization of images; and SDKs, drivers and programming support.

For more information contact Teledyne DALSA online at www.teledynedalsa.com/rad-icon.

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