CHESTNUT RIDGE, N.Y. – Teledyne LeCroy in Chestnut Ridge, N.Y., is introducing QPHY-PCIE6-TX-RX automated test and measurement software to support PCI Express 6.0 electrical test and validation. The company also is introducing SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages.
The growth of new technologies, including artificial intelligence (AI), machine learning, and high-performance computing are accelerating demand for fast access to large amounts of data.
To support this growing demand, the next generation of PCI Express, PCIe 6.0 technology will use multi-level signaling (PAM4) to double data transfer speeds from the 32 gigatransfers per second transfer speed provided by PCIe 5.0 technology. While this helps satisfy the need for fast data access, the new multi-level signaling approach will create significant new test complexities for system developers.
Teledyne LeCroy’s QPHY-PCIE6-TX-RX automated test software, and the SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages, when used together with a Teledyne LeCroy LabMaster 10 Zi-A oscilloscope and SDAIII-CompleteLinQ serial data analysis software, provide PCI Express developers with the tools they need to test and debug complex PCIe 6.0 devices.
This solution can calculate and display jitter in three transition groupings; measure transmitter equalization settings, with results and methodologies aligned with current SigTest AC fit methods; provide customizable setups for measuring preset cursors and waveforms using unique transmitter equalization tools; and measure signal-to-noise-and-distortion ratio with robust oscilloscope noise compensation and powerful signal analysis waveform views.
For more information contact Teledyne LeCroy online at https://teledynelecroy.com/pcie-electrical-test/#pcie6.
