Samtec connector picked as basis for VITA 90 VNX+ small-form-factor open-systems standard for embedded computing

Summary points:

• VITA selects Samtec interconnects as the foundation for the VITA 90 VNX+ open-systems standard for small-form-factor embedded computing.
• VNX+ plug-in modules offer rugged, high-performance solutions for UAVs, UUVs, missiles, satellites, and cube satellites, addressing space-constrained applications.
• Samtec SEARAY connectors enable high-speed 56-gigabits-per-second data transfer, reduce size, weight, and power (SWaP), and support interoperability with VITA 90 VNX+ and SOSA standards.

OKLAHOMA CITY – Experts from the VMEbus International Trade Association (VITA) in Oklahoma City have chosen interconnects from Samtec Inc. in New Albany, Ind., as the basis for the organization's VITA 90- VNX+ open-systems standard for small-form-factor embedded computing.

VNX+ -- a circuit card form factor about the size of a business card -- is a new rugged, high-performance standard recently ratified by VITA and the American National Standards Institute (ANSI) in New York.

The small size of VNX+ addresses embedded computing requirements of uncrewed aerial vehicles (UAVs), uncrewed underwater vehicles (UUVs), missiles, satellites, and cube satellites in military, aerospace, and industrial applications.

VITA standards experts adopted Samtec Interconnects for VITA 90 VNX+ to improve signal integrity and reduce the size, weight, and power consumption (SWaP) of evolving VITA standards that call for miniaturization and high performance, Samtec officials say.

Backplane and card connectors

VITA experts chose Samtec's rugged high-density interconnects and alignment components for VITA 90 plug-in module and backplane to enable a small-form-factor alternative to 3U OpenVPX, company officials say.

VITA 90 VNX+ is suitable for rugged high reliability applications, and adheres to a modular open-system design approach that provides system architects with a high-performance embedded computing circuit card and backplane connector for space-constrained harsh-environment applications.

The commonality of VNX+ plug-in module designs encourages interoperability, replaceability. The Open Group standards organization in San Francisco also has chosen Samtec interconnects as the basis for its Sensor Open Systems Architecture (SOSA) standard.

Small form factor

Samtec plug-in modules measure about 89 by 78 millimeters in single or double heights. Single-height plug-in modules are 13 millimeters or 19 millimeters tall, and double-height plug-in modules are 27 millimeters or 39 millimeters tall.

The high-speed data connector chosen for VNX+ and SOSA is Samtec's SEARAY high-speed 56-gigabit-per-second high-density array. Configurations selected for the VITA 90 standard are 4-row and 8-row with 200, 240, 320, or 400 total pins. The 320-Pin and 240-Pin connector configurations create additional space along the plug-in module's connector face, enabling the integration of connector modules.

For more information contact Samtec online at www.samtec.com/high-speed-board-to-board/high-density-arrays/searay.