NASHUA, N.H. - Join Military + Aerospace Electronics and experts from Micross to learn more procuring processed bare dies for high-reliability electronic components at our 20 June webinar at 11 a.m. EDT. Micross is a hi-rel microelectronic components and services company based in Melville, N.Y.
There are many advantages with utilizing semiconductor bare die in the design of high reliability electronic components, including the ability to maximize SWaP (size, weight, and power) optimization. However, procurement of the semiconductor die needed is not as straightforward as the procurement of off-the-shelf packaged components. For those that have a need to procure semiconductor die, while the benefits to your product design will be great, the steps and processing required can be daunting.
In this webinar, semiconductor die and wafer manufacturing experts, from leading original device manufacturers (OEMs), distribution, and back-end semiconductor value-added service providers, demystify semiconductor die procurement, and provide clear actionable guidance to navigate and mitigate potential risks in procuring bare die processed to your required specifications.
Presenters include Joseph Celania, a product Line Manager, Die and Wafer Solutions, and Britney Wolfe, Director of Operations, Die and Wafer Solutions, both at Micross.
For 33 years Joe Celania worked in the semiconductor industry as a business leader with extensive experience in developing people and visiting customers around the world. Joe’s career has been in a variety of roles at Texas Instruments including business development, marketing, program management, and quality.
Britney has been with Micross for more than 24 years, starting early on when it was formerly known as Chip Supply. During her time at Micross, she has held roles in sales, supply chain, marketing, and is currently the Director of Operations for Micross’ facility in Apopka, Fla.
