NASHUA, N.H. - Military + Aerospace Electronics cordially invites you to our 30 November webinar where you can learn more about best practices in preparing microelectronics for high-reliability applications. This event is sponsored by Micross in Melville, New York.
Commercial space programs are increasing demand for high-reliability microelectronics, but national security concerns can limit access to U.S.-based advanced semiconductor process nodes. Those attending will learn to navigate these uncertain times through innovative microelectronics design, packaging, testing, and qualification. Attendees will learn the latest options and best practices for cost-optimized hi-reliability microelectronics for demanding program requirements.
A high percentage of electronics bound for space or other high-reliability applications do not have Designed-for-Test (DFT) or Designed-for-Manufacture (DFM) availability, and as such would require a qualification test plan to be created to ensure the expected or extended program mission life desired, is achieved. It is more critical than ever for engineers to understand all the available high-reliability options for high-reliability programs.
Potential solutions range from new application-specific integrated circuit (ASIC) development to upscreening and plastic-encapsulated module (PEM) qualification of existing devices. This seminar will help engineers, program managers, and subcontractors better understand high-reliability device requirements of MIL-PRF-38535, -38534, and other qualifications and requirements, to best define the appropriate testing and qualification plan needed to meet the program’s expected mission life and budget.
Topics covered in this event include:
- Electrical testing compliance, encompassing voltage and temperature considerations, lead-time, costs, coverage, and impacts on reliability.
- Component complexity, test compliance, test time, junction or case temperature, and reliability concerns associated with sourcing large mix low-volume BOMs.
- Detection of defects at wafer probe, burn-in, electrical test, package assembly, and environmental testing, and their implications on reliability.
- Other design and testing requirements specific to high-reliability microelectronics.
Presenters include Mario Saucedo, general manager, and Ron Erickson, chief engineer, both of Micross Turnkey Solutions. With over 20 years of experience in driving new products and technologies in the microelectronics and semiconductor industry, Saucedo’s subject matter expertise spans all areas of strategic planning, R&D, operations, and business development. Erickson is an expert in Hi-Rel microelectronics electrical test, with a career spanning 22 years where he was directly responsible for new product development in test, product, and managing test, product, integrated circuit packaging, and design lab product validation engineering teams.
Don't miss this free opportunity to enhance your understanding of high-reliability options and contribute to the future of microelectronics in demanding programs. Join us on 30 November 2023. Please click here to learn more or to register!