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Power
Indium Corporation introduces Indium12.9HF solder paste for fine-feature electronics assembly
The material is formulated to deliver high stencil print transfer efficiency across a wide range of process conditions, helping improve solder paste inspection (SPI) yields in...
April 8, 2026
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PCBA DFX Considerations for Harsh Environments
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Sensors - Inertial
Silicon Sensing Systems Ltd
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Courtesy of Dawn VME Products
Components - Backplanes
Dawn VME Products Backplane Topology Customization
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Components - Connectors
EDM Intelligent Solutions (EDMIS)
April 7, 2026
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NASA Glenn gauges industry interest in advanced space environment test equipment
April 7, 2026
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Space Systems Command establishes new pair of defensive cyber squadrons to protect launch operations
April 7, 2026
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Samtec introduces new signaling options for AcceleRate Slim cable assemblies targeting high-density systems
April 7, 2026
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